EVALUATION COMPONENT, ELECTRONIC BOARD, AND ELECTRONIC BOARD PRODUCTION SYSTEM

• Main Author: YOKOTA WATARU
• Format: Patent
• Language: English; Japanese
• Published: 11.01.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide an evaluation component capable of appropriately evaluating wet spreadability and wettability of solder, in soldering using solder paste, during electronic board assembly.SOLUTION: In a wettability evaluation cylinder 10 as an evaluation component that is used for evaluating wettability of solder, when soldering to the wiring board electrode 110 of a wiring board 100, soldering is performed using solder paste. The wettability evaluation cylinder 10 has a metal exposure part on the cylinder side that is perpendicular to the wiring board electrode 110 when soldering.SELECTED DRAWING: Figure 2 【課題】電子基板組み立て中の、ソルダペーストを用いたはんだ付けにおける、はんだの濡れ広がり性、及び濡れ上がり性について、適切に評価することができる評価用部品を提供する。【解決手段】配線板１００の配線板電極１１０へのはんだ付けを行うときの、はんだの濡れ性を評価するときに用いられる評価用部品としての濡れ性評価用円筒１０であって、はんだ付けは、ソルダペーストを用いて行われる。そして、濡れ性評価用円筒１０は、はんだ付けが行われるときに、配線板電極１１０に対して垂直な筒側面に金属露出部を有する。【選択図】図２