ELECTRONIC DEVICE AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE

• Main Authors: YAMAGISHI TETSUTO, IKOMA RYUTA
• Format: Patent
• Language: English; Japanese
• Published: 11.01.2018
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic device that hinders resin burr without applying significant force to a circuit board.SOLUTION: An electronic device has a circuit board 10, a circuit element, and mold resin 40. In the mold resin 40, a mold through-hole 41 is formed, which extends in a plate thickness direction of the circuit board 10. In a manufacturing method for an electronic device, a circuit board 10 on which a circuit element is mounted is fixed in a first mold, and a compositional material for mold resin 40 is disposed in a cavity of a lower mold. Then, a movable pin and an upper mold are approached each other and a resin base material is pressed via an elastic member lower in elastic modulus than the resin base material for the circuit board 10, thereby deforming the elastic member and sealing a space between the movable pin and the circuit board 10. Then, while the space between the movable pin and the circuit board 10 is kept sealed and the cavity is hermetically sealed, one surface S1 and a circuit element are covered with the compositional material in the cavity and, at the same time, the compositional material is hardened to thereby mold the mold resin 40.SELECTED DRAWING: Figure 3 【課題】回路基板に大きな力を作用させることなく、樹脂ばりを抑制する電子装置の製造方法を提供する。【解決手段】電子装置は、回路基板１０と、回路素子と、モールド樹脂４０と、を有している。モールド樹脂４０には、回路基板１０の板厚方向に貫通するモールド貫通穴４１が形成されている。電子装置の製造方法では、回路素子が実装された回路基板１０を第１金型に固定し、下型のキャビティ内にモールド樹脂４０の構成材料を配置する。次に、可動ピンと上型とを近づけて、回路基板１０の樹脂基材よりも弾性率の低い弾性部材を介して、樹脂基材を押圧することで、弾性部材を変形させて可動ピンと回路基板１０との間をシールする。そして、可動ピンと回路基板１０との間をシールし、且つ、キャビティを密閉した状態で、キャビティ内の構成材料で一面Ｓ１及び回路素子を覆いつつ、構成材料を固めることによってモールド樹脂４０を成形する。【選択図】図３