METALLIC FOIL WITH RESIN, LAMINATED PLATE, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD

• Main Authors: TAKAHASHI HIROAKI, SATO TOMIYUKI, USHIJIMA HIDEHARU, AOKI TOMOYUKI, HIRAGA MASAHIRO, MATSUZAKI YOSHINORI
• Format: Patent
• Language: English; Japanese
• Published: 11.01.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a metal-clad laminate and a multilayer printed wiring board which can be molded at low temperature and include a cured product of a thermosetting resin composition having a low dielectric constant and a low dielectric tangent and also having high heat resistance.SOLUTION: A metallic foil with a resin include a metallic foil, a first resin layer stacked on the metallic foil and a second resin layer stacked on the first resin layer. The first resin layer contains at least one component selected from the group consisting of a liquid crystal polymer resin, a polyimide resin, a polyamideimide resin, a fluorine resin and a polyphenylene ether resin. The second resin is formed of a dry matter or a semi-cured matter containing a thermosetting resin composition.SELECTED DRAWING: Figure 1 【課題】低温で成形可能であり、その硬化物は低い誘電率及び低い誘電正接を有しうるとともに高い耐熱性も有しうる熱硬化性樹脂組成物の硬化物を含むことを特徴とする金属張積層板及び多層プリント配線板を提供する。【解決手段】金属箔と、その金属箔上に重なる第一の樹脂層と、その第一の樹脂層上に重なる第二の樹脂層を備える樹脂付き金属箔に関する。第一の樹脂層は、液晶ポリマー樹脂、ポリイミド樹脂、ポリアミドイミド樹脂、フッ素樹脂及びポリフェニレンエーテル樹脂からなる群から選択される少なくとも一種の成分を含む。第二の層は、熱硬化性樹脂組成物を含む乾燥物又は半硬化物からなる。【選択図】図１