POLISHING METHOD OF COMPOSITE SUBSTRATE, MANUFACTURING METHOD OF MEMS DEVICE, AND MANUFACTURING METHOD OF LIQUID JET HEAD

• Main Authors: HIRAI EIKI, NISHIOMOTE MUNEHIDE
• Format: Patent
• Language: English; Japanese
• Published: 11.01.2018
• Subjects: CORRECTION OF TYPOGRAPHICAL ERRORS; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; POLISHING; PRINTING; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; SELECTIVE PRINTING MECHANISMS; STAMPS; TRANSPORTING; TYPEWRITERS

PROBLEM TO BE SOLVED: To provide the polishing method of a composite substrate suppressing the polishing unevenness, the manufacturing method of a MEMS device, and the manufacturing method of a liquid jet head.SOLUTION: In polishing methods of a composite substrate (40) in which, while joining together a first substrate (41) and a second substrate (42), a space (34) partitioned by at least any one of the first substrate (41) and the second substrate (42) and a through hole (38) communicating with the space are formed, the present polishing method is characterized such that in a state where the space (34) is applied pressure by introducing a gas from the through hole (38) thereto, the composite substrate (40) is pressed from the second substrate (42) side toward the polishing surface (44a) side of the polishing device (43) to polish the surface of the first substrate (41) opposite to the substrate (42).SELECTED DRAWING: Figure 4 【課題】研磨ムラが抑制された複合基板の研磨方法、ＭＥＭＳデバイスの製造方法、及び、液体噴射ヘッドの製造方法を提供する。【解決手段】第１の基板（４１）と第２の基板（４２）とが接合されて成り、少なくとも第１の基板（４１）又は第２の基板（４２）の何れか一方の基板により区画された空間（３４）と、空間と連通する貫通孔（３８）と、が形成された複合基板（４０）の研磨方法であって、貫通孔（３８）から気体を導入して空間（３４）内を加圧した状態で、複合基板（４０）を第２の基板（４２）側から研磨装置（４３）の研磨面（４４ａ）側へ押圧して第１の基板（４１）の第２の基板（４２）とは反対側の面を研磨することを特徴とする複合基板の研磨方法。【選択図】図４