SOLDER ALLOY, AND RESIN FLUX CORED SOLDER

• Main Authors: FURUSAWA MITSUYASU, MORI KIMIAKI, YUKIKATA KAZUHIRO
• Format: Patent
• Language: English; Japanese
• Published: 11.01.2018
• Subjects: ALLOYS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a solder alloy capable of preventing the loss of a plated layer effectively even if a contact is repeated in the state, in which a plated layer containing Fe as a main component is molten.SOLUTION: The solder alloy contains Fe in 0.01 mass % to 0.1 mass %, Co in 0.005 mass % to less than 0.02 mass %, Ag in mass % to 0.1 mass % to 4.5 mass %, Cu in 0.1 mass % to 0.8 mass %, and the remainder being made of Sn.SELECTED DRAWING: None 【課題】Ｆｅを主成分として含有するメッキ層に溶融した状態での接触を繰り返しても、メッキ層の喪失を効果的に防止することができるはんだ合金を提供することを課題とする。【解決手段】Ｆｅが０．０１質量％以上０．１質量％以下、Ｃｏが０．００５質量％以上０．０２質量％未満、Ａｇが０．１質量％以上４．５質量％以下、Ｃｕが０．１質量％以上０．８質量％以下、残部がＳｎからなる。【選択図】なし