SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces reverse recovery time without increasing leakage current between a drain and a source, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device and a method of manufacturing the same compr...

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Bibliographic Details
Main Author NAKAJIMA TOSHIO
Format Patent
LanguageEnglish
Japanese
Published 28.12.2017
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces reverse recovery time without increasing leakage current between a drain and a source, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device and a method of manufacturing the same comprise: a first base layer (12); a drain layer (10) provided on a rear face of the first base layer; a second base layer (16) formed on a surface of the first base layer; a source layer (18) formed on a surface of the second base layer; a gate insulation film (20) arranged on the surfaces of the source layer and the second base layer; a gate electrode (22) arranged on the gate insulation film; a column layer (14) formed in the first base layer (12) under the second base layer and the source layer to face the drain layer; a drain electrode (28) provided in the drain layer; and a source electrode (26) provided on the source layer and the second base layer, in which trap level is locally formed by heavy particles irradiation on the column layer.SELECTED DRAWING: Figure 1 【課題】ドレイン・ソース間のリーク電流を増大させずに逆回復時間を短縮する半導体装置およびその製造方法を提供する。【解決手段】第1ベース層(12)と、第1ベース層の裏面に設けられたドレイン層(10)と、第1ベース層の表面に形成された第2ベース層(16)と、第2ベース層の表面に形成されたソース層(18)と、ソース層および第2ベース層の表面上に配置されたゲート絶縁膜(20)と、ゲート絶縁膜上に配置されたゲート電極(22)と、第2ベース層およびソース層の下部の第1ベース層(12)内にドレイン層に対向して形成されたコラム層(14)と、ドレイン層に設けられたドレイン電極(28)と、ソース層および第2ベース層に設けられたソース電極(26)とを備え、コラム層に対して重粒子照射を行い、トラップレベルを局所的に形成した半導体装置およびその製造方法。【選択図】図1
Bibliography:Application Number: JP20170168375