ADDITIVE FOR ELECTROLYTIC COPPER PLATING SOLUTION, THE ELECTROLYTIC COPPER PLATING SOLUTION AND COPPER PLATING METHOD USING THE SAME

• Main Author: KANEKO HISAFUMI
• Format: Patent
• Language: English; Japanese
• Published: 28.12.2017
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

PROBLEM TO BE SOLVED: To provide an additive for an electrolytic copper plating solution capable of performing filling-in without generating voids in pores such as through holes and via holes, an electrolytic copper plating solution including the same, and an electrolytic copper plating method using...