ADDITIVE FOR ELECTROLYTIC COPPER PLATING SOLUTION, THE ELECTROLYTIC COPPER PLATING SOLUTION AND COPPER PLATING METHOD USING THE SAME

• Main Author: KANEKO HISAFUMI
• Format: Patent
• Language: English; Japanese
• Published: 28.12.2017
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

PROBLEM TO BE SOLVED: To provide an additive for an electrolytic copper plating solution capable of performing filling-in without generating voids in pores such as through holes and via holes, an electrolytic copper plating solution including the same, and an electrolytic copper plating method using the same.SOLUTION: Provided is an additive for an electrolytic copper plating solution comprising the alkylene oxide adduct (B) of polyamine (A), the polyamine (A) includes hydrogen atoms directly coupled to nitrogen atoms by 5 to 100 mol per mol of the polyamine (A), and the average addition mole number of the alkylene oxide to the polyamine (A) is 10 to 1,000 mol per mol of the hydrogen atoms directly coupled to the nitrogen atoms.SELECTED DRAWING: None 【課題】本発明は、上記事情に鑑みなされたものであり、スルーホール、ビアホール等の細孔に、ボイドを発生させること無く穴埋めすることができる電気銅めっき液用添加剤、それを含む電気銅めっき液、及びこれを用いた電気銅めっき方法を提供することを目的とする。【解決手段】ポリアミン（Ａ）のアルキレンオキサイド付加物（Ｂ）を含む電気銅めっき液用添加剤であって、前記ポリアミン（Ａ）が、窒素原子に直接結合する水素原子を、前記ポリアミン（Ａ）１モルあたり５〜１００モル有し、前記ポリアミン（Ａ）へのアルキレンオキサイドの平均付加モル数が、前記ポリアミン（Ａ）が有する窒素原子に直接結合する水素原子１モルあたり１０〜１０００モルである電気銅めっき液用添加剤。【選択図】なし