OPTICAL MODULE

PROBLEM TO BE SOLVED: To improve a space packaging density of an optical module.SOLUTION: An optical module includes: a planar optical waveguide circuit 13; a plurality of electronic components (PD array 16, PD driver 19, and others) used for processing electric signals; and auxiliary members (fixtu...

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Bibliographic Details
Main Authors NISHIZAWA TOSHIKI, MIHASHI YUJI, MARUYAMA KAZUHIRO
Format Patent
LanguageEnglish
Japanese
Published 21.12.2017
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:PROBLEM TO BE SOLVED: To improve a space packaging density of an optical module.SOLUTION: An optical module includes: a planar optical waveguide circuit 13; a plurality of electronic components (PD array 16, PD driver 19, and others) used for processing electric signals; and auxiliary members (fixture 14 and others) provided on a top surface of the planar optical waveguide circuit 13. At least one (the PD driver 19 or the like) of the plurality of electronic components is disposed on a top surface of the auxiliary member.SELECTED DRAWING: Figure 1 【課題】光モジュールの空間実装密度を向上する。【解決手段】平面光導波回路１３と、電気信号を処理するために用いる複数の電子部品（ＰＤアレイ１６，ＰＤドライバ１９等）と、平面光導波回路１３の上面に設けられた補助部材（ヤトイ１４等）と、を備え、前記複数の電子部品のうち少なくとも１つ（ＰＤドライバ１９等）を前記補助部材の上面に配置する。【選択図】図１
Bibliography:Application Number: JP20160116965