CUTTING METHOD OF WORKPIECE

• Main Authors: ETO YOSHIHIRO, FUKUSHIMA HIROTO
• Format: Patent
• Language: English; Japanese
• Published: 14.12.2017
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

PROBLEM TO BE SOLVED: To stably cut a cylindrical workpiece from the start of cutting to the end of cutting while supplying coolant to a processing point.SOLUTION: A fixed abrasive grain wire is plurally wound between a plurality of parallel main rollers 10A, 10B, 10C to form a wire row 11R, and a cylindrical workpiece W is cut off into a wafer shape by pressing the workpiece W against the wire row 11R while coolant C is supplied to the wire row 11R in a traveling state from coolant nozzles 20A, 20B. In that time, corresponding to changes of a workpiece cut length L from the start of cutting to end the of cutting the workpiece W, the positions of the coolant nozzles 20A, 20B to the workpiece W are changed in traveling direction of a wire 11, and the positions of the coolant nozzles 20A, 20B near the end of cutting the workpiece W are moved from a processing point of the workpiece W farther than the positions of the coolant nozzles 20A, 20B near the start of cutting the workpiece W.SELECTED DRAWING: Figure 2 【課題】切り始めから切り終わりまで加工点にクーラントを供給しながら円柱形のワークを安定的に切断する。【解決手段】複数の平行なメインローラ１０Ａ，１０Ｂ，１０Ｃの間に固定砥粒ワイヤを多重に巻き掛けてワイヤ列１１Ｒを形成し、走行状態のワイヤ列１１Ｒにクーラントノズル２０Ａ，２０ＢからクーラントＣを供給しながら当該ワイヤ列１１Ｒに円柱形のワークＷを押し当てることで当該ワークＷをウェーハ状に切断加工する。その際、ワークＷの切り始めから切り終わりまでのワーク切断長Ｌの変化に応じてワークＷに対するクーラントノズル２０Ａ，２０Ｂの位置をワイヤ１１の走行方向に変化させると共に、ワークＷの切り終わり付近でのクーラントノズル２０Ａ，２０Ｂの位置を、ワークＷの切り始め付近でのクーラントノズル２０Ａ，２０Ｂの位置よりもワークＷの加工点から遠ざける。【選択図】図２