MULTILAYER PRINTED CIRCUIT BOARD

• Main Authors: LEE SA YONG, KANG MYUNG-SAM, KUROYANAGI AKIHISA, MIN TAE HONG, AHN SEOK HWAN
• Format: Patent
• Language: English; Japanese
• Published: 07.12.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board.SOLUTION: A multilayer printed circuit board includes multiple conductor pattern layers, through vias for interconnecting the uppermost layer and lowermost layer of the multiple conductor pattern layers, and a first connection via for connecting the uppermost conductor pattern layer with other conductor pattern layer adjoining thereto. The through via and first connection via include, respectively, a high melting point metal layer formed in each conductor pattern layer, and a buffer layer interposed between the high melting point metal layers for distributing pressure, and having a melting point lower than that of the high melting point metal layer. The through via further includes a conductor filler formed between each high melting point metal layer and buffer layer.SELECTED DRAWING: Figure 1 【課題】多層プリント回路基板を提供する。【解決手段】本発明の一側面に係る多層プリント回路基板は、複数の導体パターン層と、複数の導体パターン層のうちの最上層と最下層とを互いに接続する貫通ビアと、最上層の導体パターン層をそれに隣接した他の導体パターン層に接続する第１接続ビアと、を含み、貫通ビアと第１接続ビアのそれぞれは、導体パターン層のそれぞれに形成された高融点金属層と、高融点金属層の間に介在され、圧力を分散させる、高融点金属層の溶融点よりも低い溶融点を有する緩衝層と、を含み、貫通ビアは、それぞれの高融点金属層と緩衝層との間にそれぞれ形成される導体フィラーをさらに含む。【選択図】図１