HEAT RADIATOR AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To deal with thinning of an electronic device, while radiating heat efficiently.SOLUTION: A heat radiator includes a first fitting part connected thermally with a heat radiation member, and having crests and throughs formed alternately, and a second fitting part connected therm...

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Bibliographic Details
Main Authors ABE TOMOYUKI, TAKASU YOICHI, HIBINO SEIJI
Format Patent
LanguageEnglish
Japanese
Published 30.11.2017
Subjects
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Summary:PROBLEM TO BE SOLVED: To deal with thinning of an electronic device, while radiating heat efficiently.SOLUTION: A heat radiator includes a first fitting part connected thermally with a heat radiation member, and having crests and throughs formed alternately, and a second fitting part connected thermally with a heating member mounted on a board, and having throughs and crests fitting to the crests and throughs of the first fitting part. At least one of the first fitting part and second fitting part includes a conductor, and at least one of the crest of the first fitting part and the crest of the second fitting part has a liquid holding cavity which holds a liquid for improving adhesion of the first and second fitting parts.SELECTED DRAWING: Figure 4 【課題】電子装置の薄型化に対応すると共に、効率的な放熱を行うことを課題とする。【解決手段】放熱装置は、放熱部材と熱的に接続され、交互に形成された山部及び谷部を有する第1嵌合部と、基板に実装されている発熱部品と熱的に接続され、前記第1嵌合部が有する山部及び谷部と互いに嵌合する谷部及び山部を有する第2嵌合部と、を備え、前記第1嵌合部と前記第2嵌合部の少なくとも一方は、導電体を含み、前記第1嵌合部が有する山部と前記第2嵌合部が有する山部の少なくとも一方は、前記第1嵌合部と前記第2嵌合部との密着性を向上させる液体を保持する液体保持空隙部を有する。【選択図】図4
Bibliography:Application Number: JP20160106514