METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

• Main Author: NAKAI MOTOO
• Format: Patent
• Language: English; Japanese
• Published: 30.11.2017
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device and the semiconductor device capable of improving voltage resistance.SOLUTION: A method of manufacturing a semiconductor device 10 includes the following steps of: mounting a semiconductor element 2 on a substrate 1; bonding a heat spreader container 3 having an opening onto an opposite side surface to the substrate 1, of the semiconductor element 2; forming resin 4 that covers a part of the container 3 and at least a part of the substrate 1 so as to expose the opening of the container 3; putting a heat storage material 5 into the container 3 from the opening after the resin 4 is formed; and covering the opening of the container 3 into which the heat storage material 5 is put, with a lid 6.SELECTED DRAWING: Figure 8 【課題】耐圧性を向上できる半導体装置の製造方法及び半導体装置を提供する。【解決手段】半導体装置１０の製造方法は、基板１に半導体素子２を実装する工程と、開口を有するヒートスプレッダの容器３を、半導体素子２の基板１と反対側の面に接合する工程と、容器３の開口が露出するように、容器３の一部及び基板１の少なくとも一部を覆う樹脂４を形成する工程と、樹脂４が形成された後に、開口から容器３の中へ蓄熱材５を入れる工程と、蓄熱材５が入った容器３の開口を蓋６で塞ぐ工程と、を有する【選択図】図８