CURABLE COMPOSITION

• Main Authors: ODAGIRI KEIICHI, SAWAMOTO DAISUKE, SAIKI TOMOAKI, FUKUNAGA HIROYA
• Format: Patent
• Language: English; Japanese
• Published: 30.11.2017
• Subjects: ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a curable composition for sealing a semiconductor, which hardly causes partial discharge even at a high voltage.SOLUTION: The curable composition contains: a polysiloxane compound having at least two SiH groups in one molecule as a component (A); a polysiloxane compound having at least two vinyl groups in one molecule as a component (B); a hydrosilylation catalyst as a component (C); and a polyether-modified polysiloxane compound represented by general formula (1) as a component (D). The content of the component (D) is 0.001-0.25 pt.mass based on 100 pts.mass of the total amount of the component (A) and the component (B).SELECTED DRAWING: None 【課題】高電圧でも部分放電が起こりにくい、半導体封止用の硬化性組成物を提供する。【解決手段】（Ａ）成分として１分子中に少なくとも２つのＳｉＨ基を有するポリシロキサン化合物と、（Ｂ）成分として１分子中に少なくとも２つのビニル基を有するポリシロキサン化合物と、（Ｃ）成分としてヒドロシリル化触媒と、（Ｄ）成分として下記一般式（１）で表されるポリエーテル変性ポリシロキサン化合物と、を含有し、（Ｄ）成分の含量が、（Ａ）成分と前記（Ｂ）成分との合計量１００質量部に対して、０．００１〜０．２５質量部である硬化性組成物である。【選択図】なし