METHOD AND DEVICE FOR POLISHING THROUGH-FLOW PASSAGE OF THREE-DIMENSIONAL STRUCTURE

• Main Authors: MORIMOTO MASANORI, ABE SATOSHI, OHARA TAKETO, WATANABE SHINYA, TANAKA KENICHI, MORI MIKIO, NAKAMURA AKIFUMI, UCHINONO YOSHIYUKI
• Format: Patent
• Language: English; Japanese
• Published: 30.11.2017
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a method for polishing a through-flow passage that can further properly polish a through-flow passage of a three-dimensional structure without using a cylinder.SOLUTION: A method for polishing a through-flow passage flows polishing fluid containing an abrasive grain and liquid through a through-flow passage to conduct polishing of a through-flow passage, especially, extracts the polishing fluid from a bottom part of a preparation closed vessel where the polishing fluid is prepared, and transfers the polishing fluid to the through-flow passage.SELECTED DRAWING: Figure 3 【課題】シリンダーを用いなくとも三次元構造体の貫通流路をより適切に研磨できる貫通流路の研磨方法を提供すること。【解決手段】砥粒および液体を含んで成る研磨流体を貫通流路に流して貫通流路の研磨処理を行う。特に、研磨流体が仕込まれた仕込み密閉容器の底部から研磨流体を抜き出して貫通流路へと送る。【選択図】図３