ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD FOR FORMING THE SAME

• Main Authors: KAMEYAMA ICHIRO, KAMIBAYASHI TETSUYA, FURUKAWA MITSUHIRO, TAKANO ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 02.11.2017
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an electronic component which dispenses with a copper plating layer and prevents a floating capacitance between the copper plating layer and an electrode of a substrate.SOLUTION: An electronic component 10 includes a substrate 11 having a functional portion 13 formed on a main surface 11a, and a first resin layer is formed on the main surface. The first resin layer 31 has a first surface 31a facing the main surface, and a second surface 31b facing the first surface. The first resin layer 31 defines a cavity 100 surrounding the functional portion 13 on the first surface 31a. The first resin layer 31 defines a recess 20 on the second surface 31b. A solder layer is formed on the recess 20 so as not to exceed the second surface in a thickness direction. The functional portion 13 includes a surface acoustic wave (SAW) element having a mechanical movable portion or a film bulk acoustic resonator (FBAR). The substrate 11 is formed of a dielectric material.SELECTED DRAWING: Figure 3 【課題】銅メッキ層を必要とせず、銅メッキ層と基板の電極との間に浮遊容量が生じない電子部品を提供する。【解決手段】電子部品１０は、主表面１１ａに機能部１３が形成された基板１１を含み、第１樹脂層が当該主表面に形成される。第１樹脂層３１は、当該主表面に面する第１面３１ａと、第１面に対向する第２面３１ｂとを有する。第１樹脂層３１は、第１面３１ａに機能部１３を囲む空洞１００を画定する。第１樹脂層３１は、第２面３１ｂに凹部２０を画定する。凹部２０には半田層が、第２面を厚さ方向を超えないように形成される。機能部１３は、機械的可動部分を有する弾性表面波（ＳＡＷ）素子又は圧電薄膜共振子（ＦＢＡＲ）を含む。基板１１は誘電体材料からなっている。【選択図】図３