THREE-DIMENSIONAL MOLDED CIRCUIT COMPONENT

• Main Authors: YAMAMOTO TOMOHITO, GOTO HIDETO, YUSA ATSUSHI, USUKI NAOKI, OTA HIROKI, KITO AKIKO
• Format: Patent
• Language: English; Japanese
• Published: 02.11.2017
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a three-dimensional molded circuit component having high heat dissipation property, easy molding and high productivity.SOLUTION: A three-dimensional molded circuit component includes: a substrate including a metal portion and a resin portion; a circuit pattern formed on the resin portion; and a mounted component mounted on the substrate and connected to the circuit pattern. A resin thin film containing a thermoplastic resin having a thickness of 0.01 mm to 0.5 mm is formed on the metal part as a part of the resin part. The mounting component is disposed on the metal portion via the resin thin film.SELECTED DRAWING: Figure 1 【課題】高い放熱性を有し、更に、成形が容易で生産性が高い三次元成形回路部品を提供する。【解決手段】三次元成形回路部品であって、金属部と樹脂部とを含む基材と、前記樹脂部上に形成されている回路パターンと、前記基材上に実装されており、前記回路パターンと電気的に接続している実装部品とを有し、前記樹脂部の一部は、厚さが０．０１ｍｍ〜０．５ｍｍである熱可塑性樹脂を含む樹脂薄膜を前記金属部上に形成しており、前記実装部品は、前記樹脂薄膜を介して前記金属部上に配置されている。【選択図】 図１