LASER PROCESSOR AND LASER PROCESSING METHOD

• Main Authors: IKEDA KEITA, KUWABARA TARO, NAKAJIMA YOJI, MIYAZU MASASHI, URANO YUKI, IIDA MASAHIKO, NOMURA SHINJI, NOTOMI JUNICHI, OGATA MASAHIKO, SUEYASU KOICHI, NAGAHARA FUJIO, TAKADA DAISUKE
• Format: Patent
• Language: English; Japanese
• Published: 02.11.2017
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a laser processing method capable of processing at high speed and high quality by scanning laser beams at a required speed and an equal speed.SOLUTION: A laser processing method includes: a step of generating tracks and speeds so that an inertia influence can be suppressed during the movement of a work-set table, and a total movement length can be shortest, and, for each required section of the track, comparing a speed differential value with an operation limit value of the acceleration/deceleration speeds serving as the reference of quality judgement to judge quality; and a step of scanning laser beams while the work-set table is being moved at a generated speed in a positive section, and, on the start point side in a negative section, interrupting irradiation with laser beams to stop processing, moving the work-set table at a required speed under this state, and, when moved to a section judged as acceptable, continuing the processing by laser beam scanning from a point where processing is interrupted.SELECTED DRAWING: Figure 3 【課題】レーザー光を所要の速度、かつ等速で走査することにより、高速、かつ高い品質で加工を行うことができるレーザー加工方法を提供する。【解決手段】ガルバノスキャナによるレーザー光の走査範囲を利用し、ワークセットテーブルの移動時において慣性の影響を抑制できるように、かつ総移動長が最短となるように、軌道及び速度を生成し、軌道の所要の区分ごとに、速度の微分値と可否の基準となる加減速度の動作限界値とを比較し、可否を判定する工程と、可の区分においては生成した速度でワークセットテーブルを移動させながらレーザー光を走査し、否の区分の始点側では、レーザー光の出射を停止して加工を止め、その状態で、同ワークセットテーブルを所要の速度で移動させ、可と判定された区分に移動したところで、加工を停めた箇所からレーザー光の走査による加工を継続する工程とを備える。【選択図】図３