ELECTRONIC COMPONENT

• Main Authors: ISHIDA KOSUKE, SASAKI KATSUFUMI
• Format: Patent
• Language: English; Japanese
• Published: 26.10.2017
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; INDUCTANCES; MAGNETS; RESONATORS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; TRANSFORMERS

PROBLEM TO BE SOLVED: To provide an electronic component capable of reducing a mounting area.SOLUTION: An electronic component 10 includes a body 12, external electrodes 14a-14e, connections 16a-16e, lead-out conductor layers 40a, 40b, 44a, 44b, connection conductors 70a-70e, electrode pads 72, 74, 76, inductors L1, L2, and capacitors C1, C2. The inductors L1, L2 connected by an interlayer connection conductor v1 are formed to insulator layers 26a-26c on an upper side of a magnetic substrate 20 so that a laminate 22 is formed, the external electrodes 14a-14d being formed to four corners of a lower surface of the magnetic substrate, the electrode pads 72, 74, 76 are formed on the upper surface of the laminate, the capacitors C1, C2 are mounted, and a mold part is formed by covering the laminate with a resin member. With this configuration, the capacitors C1, C2 can be brought close to the inductors L1, L2 in the front-back direction and the left-right direction, so that the mounting area of the electronic component 10 can be reduced.SELECTED DRAWING: Figure 2 【課題】実装面積を低減できる電子部品を提供する。【解決手段】電子部品１０は、本体１２、外部電極１４ａ〜１４ｅ、接続部１６ａ〜１６ｅ、引き出し導体層４０ａ，４０ｂ，４４ａ，４４ｂ、接続導体７０ａ〜７０ｅ、電極パッド７２，７４，７６、インダクタＬ１，Ｌ２及びコンデンサＣ１，Ｃ２を備えている。外部電極１４ａ〜１４ｄが、下面の四隅に形成された磁性基板２０の上側の絶縁体層２６ａ〜２６ｃに、層間接続導体ｖ１で接続されたインダクタＬ１、Ｌ２を形成し、積層体２２とし、その上面に電極パッド７２，７４，７６を形成しコンデンサＣ１、Ｃ２を実装し、樹脂部材で覆ってモ−ルド部としたものである。このように構成することで、コンデンサＣ１、Ｃ２とインダクタＬ１、Ｌ２とを前後方向及び左右方向に近づけることができ、電子部品１０の実装面積が低減される。【選択図】図２