SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure to form a super lattice or a quantum well structure in a columnar semiconductor layer depending on a difference in work functions of a metal and a semiconductor; or provide a semiconductor device capable of a high-speed opera...

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Bibliographic Details
Main Authors NAKAMURA HIROKI, MASUOKA FUJIO
Format Patent
LanguageEnglish
Japanese
Published 19.10.2017
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure to form a super lattice or a quantum well structure in a columnar semiconductor layer depending on a difference in work functions of a metal and a semiconductor; or provide a semiconductor device capable of a high-speed operation.SOLUTION: A semiconductor device includes: a planar semiconductor layer 101 formed on a substrate 100; a columnar semiconductor layer 102 formed on the planar semiconductor layer 101; a first insulator 103 which surrounds the columnar semiconductor layer 102; a first gate 104 which surrounds the first insulator 103 and is composed of a metal having a first work function; a second gate 105 which surrounds the first insulator 103 and is composed of a metal having a second work function different from the first work function; a third gate 106 which surrounds the first insulator 103 and is composed of a metal having the first work function; a first metal layer 110 which surrounds the first insulator 103 and has a third work function; and a second metal layer 109 which surrounds the first insulator 103 and has the third work function.SELECTED DRAWING: Figure 1 【課題】金属と半導体との仕事関数差によって柱状半導体層に超格子もしくは量子井戸構造を形成する構造を有する半導体装置もしくは高速動作が可能な半導体装置を提供する。【解決手段】半導体装置は、基板100上に形成された平面状半導体層101と、平面状半導体層101上に形成された柱状半導体層102と、前記柱状半導体層102を囲む第1の絶縁物103と、前記第1の絶縁物103を取り囲む第1の仕事関数を有する金属からなる第1のゲート104と、前記第1の絶縁物103を取り囲む前記第1の仕事関数と異なる第2の仕事関数を有する金属からなる第2のゲート105と、前記第1の絶縁物103を取り囲む第1の仕事関数を有する金属からなる第3のゲート106と、前記第1の絶縁物103を取り囲む第3の仕事関数を有する第1の金属層110と、前記第1の絶縁物103を取り囲む第3の仕事関数を有する第2の金属層109と、を有する。【選択図】図1
Bibliography:Application Number: JP20170102580