SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: ISHII HIROAKI, TAKEAKI REI
• Format: Patent
• Language: English; Japanese
• Published: 19.10.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To make a processing width of a substrate peripheral part thin, and improve uniformity of the processing width.SOLUTION: A substrate processing apparatus comprises: a holding member that nearly horizontally holds a substrate from a lower direction, and is rotatably provided around a predetermined rotary shaft; a rotation mechanism that can rotate the holding member around the rotary shaft; a separate member that is arranged on an outer side of the substrate along a radial direction of the substrate while having a gap between itself and an end surface of the substrate held by the holding member; and a nozzle that discharges a processing liquid from an upper direction of a discharge target area so that at least one part contacts with the discharge target area included in an upper surface of the separate member. The gap between the separate member and the end surface of the substrate is provided so that the processing liquid having contacted with the discharge target area is ejected from an inner side edge of the rotary shaft side on the upper surface by flowing on the upper surface of the separate member, and contacts with an upper surface peripheral edge part of the substrate from an upper direction.SELECTED DRAWING: Figure 4 【課題】基板の周縁部の処理幅を細くするとともに、処理幅の均一性を向上させる。【解決手段】基板処理装置は、基板を下方から略水平に保持し、所定の回転軸を中心に回転可能に設けられた保持部材と、保持部材を、回転軸を中心に回転させることができる回転機構と、保持部材に保持されている基板の端面と隙間を隔てて基板の径方向に沿って基板の外側に配置される別部材と、少なくとも一部が別部材の上面に含まれる吐出目標領域に当たるように吐出目標領域の上方から処理液を吐出するノズルと、を備え、別部材と基板の端面との隙間は、吐出目標領域に当たった処理液が、別部材の上面を流れて当該上面の回転軸側の内側端から排出され、基板の上面周縁部に上方から当たるように設定されている。【選択図】図４