POLYPHENYLENE ETHER MODIFIED PHENOL BENZALDEHYDE POLYFUNCTIONAL EPOXY RESIN AND USE THEREOF

PROBLEM TO BE SOLVED: To provide insulation materials with highly reliability for electronic components such as EMC, PCB substrates, laminates and insulation boards.SOLUTION: The present invention provides polyphenylene ether modified phenol benzaldehyde polyfunctional epoxy resin, represented by fo...

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Bibliographic Details
Main Authors YU JAOU-SHAIN, LEE CHENGUNG, WU CHEN-HUA, HWANG YEONG-TONG
Format Patent
LanguageEnglish
Japanese
Published 19.10.2017
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Summary:PROBLEM TO BE SOLVED: To provide insulation materials with highly reliability for electronic components such as EMC, PCB substrates, laminates and insulation boards.SOLUTION: The present invention provides polyphenylene ether modified phenol benzaldehyde polyfunctional epoxy resin, represented by formula (I) (A is a phenol benzaldehyde polyfunctional epoxy group).SELECTED DRAWING: None 【課題】EMC、PCB基材、積層及び絶縁板などの信頼性の高い電子部品用の絶縁材料の提供。【解決手段】式(I)で表されるポリフェニレンエーテル変性フェノールベンズアルデヒド多官能性エポキシ樹脂。(Aはフェノールベンズアルデヒド多官能性エポキシ基)【選択図】なし
Bibliography:Application Number: JP20160081766