DISPERSION SOLUTION OF COPPER FINE PARTICLE AGGREGATE, MANUFACTURING METHOD OF SINTERED CONDUCTOR AND MANUFACTURING METHOD OF SINTERED CONDUCTOR JUNCTION MEMBER

• Main Authors: NITTA NORZAFRIZA, FUJIWARA HIDEMICHI
• Format: Patent
• Language: English; Japanese
• Published: 12.10.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASTING; CONDUCTORS; ELECTRICITY; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; NANOTECHNOLOGY; PERFORMING OPERATIONS; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; TRANSPORTING; WORKING METALLIC POWDER

PROBLEM TO BE SOLVED: To provide a dispersion solution of a copper fine particle aggregate to which a sintering condition of low compression (10 MPa or less) and low heating (300°C or less) can suitable be applied.SOLUTION: There is provided a dispersion solution of a copper fine particle aggregate by dispersing a copper fine particle aggregate (A) which is manufactured by binding a plurality of copper fine particles (P1) having average primary particle diameter in a range of 5 to 100 nm and a surface coated by polymer dispersant (D) via the polymer dispersant (D) each other and has compression strength in a collapse force measurement test measured by dispersion the same in 1-propanol of 5 MPa or more and has average particle diameter in a range of 5 to 50 μm in an organic solvent (S) to which the polymer dispersant (D) can be soluble.SELECTED DRAWING: Figure 1 【課題】低加圧（１０ＭＰａ以下）・低加熱（３００℃以下）による焼結条件を好適に適用できる銅微粒子集合体の分散溶液を提供する。【解決手段】平均一次粒径が５〜１００ｎｍの範囲にある、高分子分散剤（Ｄ）で被覆された表面を有する銅微粒子（Ｐ１）の複数個が、当該高分子分散剤（Ｄ）を介して互いに連結されてなる、１−プロパノールに分散させて測定される圧壊力測定試験における圧縮強度が５ＭＰａ以上である銅微粒子集合体（Ａ）であって、平均粒径が５〜５０μｍの範囲にある当該銅微粒子集合体（Ａ）を、当該高分子分散剤（Ｄ）が可溶な有機溶媒（Ｓ）に分散させてなる、銅微粒子集合体の分散溶液。【選択図】図１