COPPER CLAD LAMINATE SHEET AND MANUFACTURING METHOD THEREFOR

• Main Authors: OGAMI HIROYUKI, ORITA TAKAHIRO, IWASAKO YASUSHI, UENO SUKETSUGU, FURUKAWA KOTARO
• Format: Patent
• Language: English; Japanese
• Published: 12.10.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a copper clad laminate having high reflection rate to visible light and ultraviolet light and excellent in ultraviolet resistance or heat resistance.SOLUTION: A copper clad laminate sheet has a structure having a copper layer, a white layer, an adhesive layer and a high thermal conducive substrate with thermal conductivity of 200 W/m K or more in this order, the white layer has a composition having a filler of one of BN, ZrO, SiO, CaFand diamond high in ultraviolet light reflection rate in a matrix of organopolysiloxane high in ultraviolet resistance and the white layer and an aluminum substrate are conjugated by a thermal conductive resin.SELECTED DRAWING: Figure 3 【課題】可視光および紫外光に対して高い反射率を有し、紫外光耐性や耐熱性に優れた銅張積層板を提供する。【解決手段】銅張積層板を、銅層、白色層、接着層および熱伝導率が２００Ｗ／ｍ・Ｋ以上の高熱伝導基板をこの順に有し、白色層を紫外光耐性が高いオルガノポリシロキサンのマトリックス中に紫外光反射率の高いＢＮ、ＺｒＯ２、ＳｉＯ２、ＣａＦ２、ダイヤモンドのうちいずれかのフィラーを有する組成とし、白色層とアルミニウム基板とを熱硬化性樹脂にて接合した構造とした。【選択図】図３