CIRCUIT ARRANGEMENT

• Main Authors: KUBOKI SADAO, XU CHANG LONG, TAKIOKA SHUICHI, HORIKOSHI TAKASHI, YUYAMA TOMONOBU
• Format: Patent
• Language: English; Japanese
• Published: 05.10.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a circuit arrangement capable of preventing an edge connector from being warped by heat, simplifying a structure and reducing component cost.SOLUTION: The present invention relates to a circuit arrangement 10 including a substrate 30 on which an edge connector 20 is formed, and a resin part 40 which is integrally formed on the substrate 30 so as to expose the edge connector 20. The substrate 30 includes a core layer 32 and pattern layers 33a and 33b that are disposed along both surfaces of the core layer 32. The pattern layers 33a and 33b are formed so as to be spread over a portion of the edge connector 20 and the resin part 40.EFFECT: Since the pattern layer is a so-called flat pattern that is formed to be spread over the edge connector portion and the resin part, amounts of elongation due to thermal expansion of the pattern layers become equal on an upper surface and a lower surface of the core layer, thereby preventing the edge connector from being warped.SELECTED DRAWING: Figure 3 【課題】エッジコネクタの熱による反り返りを防止するとともに、構造が簡単で部品コストを低減することができる回路装置を提供することを課題とする。【解決手段】エッジコネクタ２０が形成された基板３０と、この基板３０にエッジコネクタ２０を露出させるように一体に形成された樹脂部４０とを含む回路装置１０である。基板３０は、コア層３２及びこのコア層３２の両面に沿って配置するパターン層３３ａ、３３ｂを有する。パターン層３３ａ、３３ｂは、エッジコネクタ２０部分と樹脂部４０にわたり広がるように形成されている。【効果】パターン層は、エッジコネクタ部分と樹脂部にわたり広がるように形成されたいわゆるベタパターンであるので、コア層の上面と下面におけるパターン層の熱膨張による伸び量が同等になり、エッジコネクタの反り返りを防止することができる。【選択図】図３