CIRCUIT ARRANGEMENT

• Main Authors: KUBOKI SADAO, XU CHANG LONG, TAKIOKA SHUICHI, HORIKOSHI TAKASHI, YUYAMA TOMONOBU
• Format: Patent
• Language: English; Japanese
• Published: 05.10.2017
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a circuit arrangement which is satisfactorily filled with a resin, prevents the resin from being leaked to a connector part and is capable of reducing component cost.SOLUTION: The present invention relates to a circuit arrangement including multiple terminals and a resist insulating the terminals in end portions; and a resin part which is integrally formed to expose the terminals and the resist on the substrate. The resist is provided in an outer peripheral part enclosing the entire terminals. Further, a height from a top face of the substrate to a top face of the resist is set smaller than a height from the top face of the substrate to top faces of the terminals.EFFECT: A resin can be prevented from being sneaked and leaked from a cavity to a terminal side (connector part), air within a cavity can be released and the circuit arrangement can be satisfactorily filled with the resin. Further, since an application portion of the resist is widened just to the outer peripheral part of the terminals, the need of additional components like the prior arts is eliminated, thereby reducing component cost.SELECTED DRAWING: Figure 2 【課題】良好に樹脂が充填されるとともにコネクタ部への樹脂漏れを防止し、部品コストを低減できる回路装置を提供することを課題とする。【解決手段】端部に複数の端子及びこれらの端子を絶縁するレジストを有する基板と、この基板に端子及びレジストを露出させるように一体に形成された樹脂部とを含む回路装置についてである。レジストは、端子全体を囲う外周部に設けられている。さらに、基板の上面からレジストの上面までの高さが、基板の上面から端子の上面までの高さより小さく設定されている。【効果】樹脂がキャビティから端子側（コネクタ部）へ回り込んで漏れてくることを防止するとともにキャビティ内の空気を逃がすことができ、良好に樹脂を充填することができる。さらに、レジストの塗布部分を端子の外周部に広げただけであるので、従来技術のような別部品が不要となり、部品コストを低減できる。【選択図】図２