THERMAL TYPE FLOWMETER
PROBLEM TO BE SOLVED: To provide a thermal type flowmeter with which it is possible to easily establish electrical connection with a metal conductor arranged at a place where a gas to be measured passes through.SOLUTION: The thermal type flowmeter comprises: a circuit package 4 in which a lead frame...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
05.10.2017
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a thermal type flowmeter with which it is possible to easily establish electrical connection with a metal conductor arranged at a place where a gas to be measured passes through.SOLUTION: The thermal type flowmeter comprises: a circuit package 4 in which a lead frame and an LSI mounted on the lead frame are integrally molded with a resin material; a housing 1 in which the circuit package 4 is disposed; and a metal conductor arranged at a place where a gas 2 to be measured passes through. The circuit package 4 is provided with a lead frame exposure portion 17 having a portion of the lead frame exposed from the resin material and electrically connectable to the metal conductor. The metal conductor and the lead frame exposure portion 17 are connected by a conductive silicone rubber 9.SELECTED DRAWING: Figure 1
【課題】被計測気体が通過する場所に配置される金属導体との電気的な接続を簡単にとることができる熱式流量計を提供する。【解決手段】リードフレームとリードフレームに実装されるLSIとが樹脂材で一体にモールドされた回路パッケージ4と、回路パッケージ4が搭載されたハウジング1と、被計測気体2が通過する場所に配置される金属導体を有している。そして、回路パッケージ4には、リードフレームの一部を樹脂材から露出させて金属導体に電気的に接続可能なリードフレーム露出部17が設けられている。金属導体とリードフレーム露出部17は導電性のシリコーンゴム9で接続されている。【選択図】図1 |
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Bibliography: | Application Number: JP20160072405 |