CURED ARTICLE OF THERMOSETTING RESIN COMPOSITION, SUBSTRATE HAVING CURED ARTICLE AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

• Main Author: MOROKOSHI SHINTA
• Format: Patent
• Language: English; Japanese
• Published: 05.10.2017
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a method for manufacturing a cured article using a resin composition capable of being cured on various substrates in a short time by irradiation with near infrared ray and an application thereof.SOLUTION: A cured film can be formed in a short time by applying near infrared ray to a resin composition containing an epoxy compound (A), an epoxy curing agent (B) and a photothermal conversion agent (C). The resulting cured film has no appearance defect, is excellent in adhesiveness with SUS304, aluminum, a glass substrate or the like and is good in saline water resistance, thermal impact resistance and further heat release property.SELECTED DRAWING: None 【課題】 近赤外線の照射により種々の基材上で短時間硬化が可能な樹脂組成物を用いて硬化物を製造する方法とその用途を提供すること。【解決手段】 エポキシ化合物（Ａ）、エポキシ硬化剤（Ｂ）、および、光熱変換剤（Ｃ）を含有する樹脂組成物へ近赤外線照射することにより短時間で硬化膜を形成することができる。また、得られた硬化膜は、外観不良がなく、ＳＵＳ３０４やアルミ、ガラス基材等の密着性に優れ、塩水耐性、熱衝撃耐性、さらには放熱特性も良好なものとなる。【選択図】 なし