RESIN SHEET
PROBLEM TO BE SOLVED: To provide a resin sheet which can impart a thin insulating layer excellent in insulating performance.SOLUTION: There is provided a resin sheet which contains a support body and a resin composition layer bonded to the support body, where extraction water conductivity A of a cur...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
05.10.2017
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a resin sheet which can impart a thin insulating layer excellent in insulating performance.SOLUTION: There is provided a resin sheet which contains a support body and a resin composition layer bonded to the support body, where extraction water conductivity A of a cured product of the resin composition layer at 120°C for 20 hours is 50 μS/cm or less, and extraction water conductivity B of a cured product of the resin composition layer at 160°C for 20 hours is 200 μS/cm or less.SELECTED DRAWING: None
【課題】絶縁性能に優れた薄い絶縁層を付与可能な樹脂シートを提供する。【解決手段】支持体と、該支持体上に接合した樹脂組成物層と、を含む樹脂シートであって、該樹脂組成物層の硬化物の120℃20時間の抽出水導電率Aが50μS/cm以下であり、かつ、該樹脂組成物層の硬化物の160℃20時間の抽出水導電率Bが200μS/cm以下である、樹脂シート。【選択図】なし |
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Bibliography: | Application Number: JP20160066204 |