FAN-OUT SEMICONDUCTOR PACKAGE

• Main Authors: LEE DOO HWAN, BYUN DAE JUNG, KO TAE HO, KIM EUN SIL, YEONG A KIM
• Format: Patent
• Language: English; Japanese
• Published: 28.09.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a fan-out semiconductor package in which connection terminals may be extended also to the outside of a region where a semiconductor chip is disposed.SOLUTION: A fan-out semiconductor package 100A comprises: a first interconnection member 110 having a through-hole; a semiconductor chip 120 disposed in the through-hole and having an active surface on which a connection pad 122 is disposed and an inactive surface deposed on a side opposite to the active surface; an encapsulant 130 encapsulating at least portions of the first interconnection member 110 and the inactive surface of the semiconductor chip 120; a second interconnection member 140 disposed on the first interconnection member 110 and the active surface of the semiconductor chip 120; and a reinforcing layer 181 disposed on the encapsulant 130. The first interconnection member 110 and the second interconnection member 140 respectively include redistribution layers 142a and 142b electrically connected to the connection pad 122 of the semiconductor chip 120.SELECTED DRAWING: Figure 9 【課題】接続端子を半導体チップが配置されている領域外にも拡張することができるファン−アウト半導体パッケージを提供する。【解決手段】ファン−アウト半導体パッケージ１００Ａは、貫通孔を有する第１連結部材１１０と、上記貫通孔に配置され、接続パッド１２２が配置された活性面及び上記活性面の反対側に配置された非活性面を有する半導体チップ１２０と、上記第１連結部材１１０及び上記半導体チップ１２０の非活性面の少なくとも一部を封止する封止材１３０と、上記第１連結部材１１０及び上記半導体チップ１２０の活性面上に配置された第２連結部材１４０と、上記封止材１３０上に配置された補強層１８１と、を含む。上記第１連結部材１１０及び上記第２連結部材１４０は、上記半導体チップ１２０の接続パッド１２２と電気的に連結された再配線層１４２ａ、１４２ｂをそれぞれ含む。【選択図】図９