SEMICONDUCTOR DEVICE

• Main Authors: TANUMA DAIGO, SAKAI YOSHIMICHI
• Format: Patent
• Language: English; Japanese
• Published: 28.09.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits temperature rise of a semiconductor component.SOLUTION: A semiconductor device of an embodiment comprises: a circuit board including a first surface and a second surface located opposite to the first surface; an external connector provided on an end of the circuit board; a housing which covers the first surface and the second surface and includes a third surface which is opposite to the first surface and has a first opening, a fourth surface which is opposite to the second surface, and a fifth surface which has a second opening and faces an end of the circuit board opposite to the end where the external connector is provided; and a semiconductor chip which is located between the external connector and the fifth surface and mounted on the first surface, in which a distance between the first opening and the fifth surface is longer than a distance between the semiconductor chip and the fifth surface.SELECTED DRAWING: Figure 3 【課題】半導体部品の温度上昇を抑制した半導体装置を提供する。【解決手段】実施形態の半導体装置は、第１の面と前記第１の面の反対側に位置する第２の面とを含む回路基板と、前記回路基板の端部に設けられた外部コネクタと、前記第１の面及び前記第２の面を覆い、かつ、前記第１の面と対向し第１の開口が設けられた第３の面と、前記第２の面と対向する第４の面と、第２の開口が設けられ前記回路基板の端部と反対側の端部と対向する第５の面と、を含む筐体と、前記外部コネクタと前記第５の面との間に位置するとともに、前記第１の面に搭載された半導体チップと、を具備し、前記第１の開口と第５の面との間の距離は、前記半導体チップと第５の面との間の距離よりも長い。【選択図】図３