ILLUMINATING DEVICE

• Main Authors: ONO TETSUYA, FUJITA MASAHIRO, BETSUDA NOBUHIKO
• Format: Patent
• Language: English; Japanese
• Published: 28.09.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; USE OF MATERIALS AS ADHESIVES; WEAPONS

PROBLEM TO BE SOLVED: To improve the heat dissipation performance of an illuminating device.SOLUTION: An illuminating device according an embodiment comprises a circuit board, a radiator, and a bonding part. The circuit board comprises a first surface, and a second surface opposed to the first surface, and a light emitting element is mounted on the first surface of the circuit board. The radiator comprises a base plate, is arranged opposite to the second surface of the circuit board, and dissipates heat emitted via the circuit board by the light emitting element. The bonding part includes metal particles, and bonds the second surface of the circuit board and the base plate of the radiator. The bonding part comprises a first region in contact with the second surface of the circuit board, a second region in contact with the base plate of the radiator, and a third region sandwiched between the first region and the second region. The heat conductivities of the first region and the second region are higher than the heat conductivity of the third region.SELECTED DRAWING: Figure 3 【課題】照明装置の放熱性を高めること。【解決手段】実施形態に係る照明装置は、回路基板と、放熱器と、接着部とを有する。回路基板は、第一の面と、第一の面に対向する第二の面とを有し、回路基板の第一の面には発光素子が搭載される。放熱器は、ベース板を有し、回路基板の第二の面に対向して配置され、発光素子が回路基板を介して発する熱を放散する。接着部は、金属粒子を含み、回路基板の第二の面と放熱器のベース板とを接着する。接着部は、回路基板の第二の面に接する第一の領域、放熱器のベース板に接する第二の領域、及び、第一の領域と第二の領域との間に挟まれた第三の領域を有する。第一の領域及び第二の領域の熱伝導率が、第三の領域の熱伝導率より高い。【選択図】図３