PEELING DEVICE OF CIRCUIT BOARD

• Main Authors: AIBA HISATOSHI, OKA TAKAO, FUJITA TAKASHI
• Format: Patent
• Language: English; Japanese
• Published: 21.09.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HAND TOOLS; MANIPULATORS; PERFORMING OPERATIONS; PORTABLE POWER-DRIVEN TOOLS; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To prevent one circuit board to be cracked when one circuit board of two laminated circuit boards is peeled from the other circuit board.SOLUTION: A peeling device 1 of a circuit board is constructed so that each line of a suction pad group 7 (first line L1 to a third line L3) sucks a supporting glass circuit board 3 by a suction pad 6, and is moved to an upper direction separating from the glass circuit board 2 sequentially to a rear line side from a front line side, thereby gradually peeling a not-peeled part 3a of the supporting glass circuit board 3 along a peeling direction P from the glass circuit board 2. In accordance with the movement from an initial position SH of a movable body 5 holding the suction pad group 7, the suction pad 6 is arranged in a position of the second and subsequent lines from the beginning (the second line L2 and the third line L3) is constructed so as to be extended to the upper direction corresponding to a movement distance of the movable body 5, and an extendable stroke becomes longer at the suction pad 6 to be set at more rear line.SELECTED DRAWING: Figure 4 【課題】積層された二枚の基板の一方基板を他方基板から剥離させるに際し、一方基板の割れを防止すること。【解決手段】吸着パッド群７の各列（第一列Ｌ１〜第三列Ｌ３）が、支持ガラス基板３を吸着パッド６で吸着しつつ、前列側から後列側へと順々にガラス基板２から離反する上方向に移動することで、剥離方向Ｐに沿って支持ガラス基板３の未剥離部位３ａをガラス基板２から漸次に剥離させるように構成された基板の剥離装置１において、吸着パッド群７を保持する可動体５の初期位置ＳＨからの移動に伴って、前から二列目以降（第二列Ｌ２および第三列Ｌ３）に配置された吸着パッド６が、可動体５の移動距離に応じて上方向に伸長可能な構成とされると共に、後列に配置された吸着パッド６ほど、伸長可能なストロークが長くなるようにした。【選択図】図４