FIXING DEVICE, IMAGE FORMING DEVICE, HEATING DEVICE, AND MANUFACTURING METHOD FOR HEATING DEVICE

PROBLEM TO BE SOLVED: To suppress the damage on a heating member as compared to the structure in which a cavity exists between a resistor element and a substrate.SOLUTION: A fixing device includes: a heating member including a substrate 110, a resistive heat generator 120 that is provided on the sub...

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Main Authors NIITSU TAKEHIRO, HAGA KOICHI, HAYASHI KAZUHIRO, MURATA MICHIAKI, YAMADA SHUICHI, TAKAHASHI MUTSUYA
Format Patent
LanguageEnglish
Japanese
Published 21.09.2017
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Summary:PROBLEM TO BE SOLVED: To suppress the damage on a heating member as compared to the structure in which a cavity exists between a resistor element and a substrate.SOLUTION: A fixing device includes: a heating member including a substrate 110, a resistive heat generator 120 that is provided on the substrate 110 and generates heat by current, a PTC element 130 provided on the substrate 110 and serially connected electrically to the resistive heat generator 120, an insulating layer 160 provided on the substrate 110, insulating between the substrate 110 and the resistive heat generator 120 and the PTC element 130, and filling the space between the substrate 110 and the PTC element 130, and a protective layer that is provided to cover the resistive heat generator 120 and the PTC element 130 to protect the resistive heat generator 120 and the PTC element 130; a belt member that is heated in contact with one surface side of the heating member and circulates; and a compressing member forming a nip part in contact with the belt member.SELECTED DRAWING: Figure 3 【課題】抵抗素子と基板との間に空洞を有する構成と比較し、加熱部材に損傷が生じにくくなる。【解決手段】基板110と、基板110上に設けられ電流によって発熱する抵抗発熱体120と、基板110上に設けられ抵抗発熱体120と電気的に直列に接続されるPTC素子130と、基板110上に設けられ基板110と抵抗発熱体120およびPTC素子130とを絶縁し基板110とPTC素子130との間の空間を埋める絶縁層160と、抵抗発熱体120及びPTC素子130を覆うように設けられ抵抗発熱体120及びPTC素子130を保護する保護層と、を有する加熱部材と、加熱部材の一方の表面側に接して加熱されるとともに循環するベルト部材と、ベルト部材に接してニップ部を形成する加圧部材と、を備える定着装置。【選択図】図3
Bibliography:Application Number: JP20160054854