COUPLING DEVICE AND COUPLING DEVICE INSTALLATION STRUCTURE

PROBLEM TO BE SOLVED: To provide a coupling device and a coupling device installation structure in which a damper does not cause attenuation force in a small earthquake.SOLUTION: A coupling device 1 couples, to each other, a damper 2 which is arranged between an upper structure body 3 and the ground...

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Main Authors INAI SHINSUKE, ANDO TOMOKI, MISU MOTOKI, YACHISE KAZUO, NAKAMURA TAKUMI, TSUYUKI YASUO, SUZUKI TAKIO, SHIRAI HIROKAZU, WATANABE KOICHI, SATO NAOKI, KATO NAOKI
Format Patent
LanguageEnglish
Japanese
Published 21.09.2017
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Summary:PROBLEM TO BE SOLVED: To provide a coupling device and a coupling device installation structure in which a damper does not cause attenuation force in a small earthquake.SOLUTION: A coupling device 1 couples, to each other, a damper 2 which is arranged between an upper structure body 3 and the ground 4, and a fixing part 5 which is fixed to the upper structure body 3 side or the ground 4 side. The coupling device 1 includes a main body 20 which is fixed to the fixing part 5, a movable body 10 which is fixed to the damper 2 and is movable relatively against the main body 20, a locking part 30 which is movable with the movable body 10 in a forward direction F and a backward direction B, a first contacting part 26 which is provided at the main body 20 and contacts the locking part 30 in the forward direction F, to restrict movement of the movable body 10 in the forward direction F, and a second contacting part 28 which is provided at the main body 20 and contacts the locking part 30 in the backward direction B, to restrict movement of the movable body 10 in the backward direction B.SELECTED DRAWING: Figure 2 【課題】 小さな地震ではダンパが減衰力を発生しない連結装置およびその連結装置の設置構造を提供する。【解決手段】 連結装置1は、上部構造体3と地盤4との間に配置されるダンパ2と、上部構造体3側または地盤4側に固定される固定部5とを連結する。連結装置1は、固定部5に固定される本体20と、ダンパ2に固定され、本体20に対し相対的に移動可能な可動体10と、可動体10と共に前進方向Fおよび後退方向Bに移動可能な係止部30と、本体20に設けられ、前進方向Fで係止部30に接触して可動体10の前進方向Fの移動を制限する第1当接部26と、本体20に設けられ、後退方向Bで係止部30に接触して可動体10の後退方向Bの移動を制限する第2当接部28と、を含む。【選択図】 図2
Bibliography:Application Number: JP20160050952