COPPER ALLOY SHEET MATERIAL AND MANUFACTURING METHOD THEREFOR

• Main Authors: ISOMATSU TAKEMI, DANJO SHOICHI
• Format: Patent
• Language: English; Japanese
• Published: 14.09.2017
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CABLES; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS; CHEMISTRY; CONDUCTORS; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; INSULATORS; METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TREATMENT OF ALLOYS OR NON-FERROUS METALS

PROBLEM TO BE SOLVED: To provide a copper alloy sheet material or the like capable of stably providing required properties such as spring property without depending on a direction to collect samples having a predetermined shape (for example terminal material) from a sheet material.SOLUTION: A copper alloy sheet material is a copper alloy material for electric and electronic device having an alloy composition containing Ni of 3.5 to 25 mass% and Sn of 0.1 to 9.5 mass% and the balance Cu with inevitable impurities and a rolling aggregate structure, the rolling aggregate structure has average of an orientation density of α-fiber (φ=0° to 45°) in a range of 2.5 to 30.0 and average of an orientation density of β-fiber (φ=45° to 90°) in a range of 2.5 to 30.0, obtained by an aggregate structure analysis by EBSD.SELECTED DRAWING: Figure 1 【課題】本発明は、板材から所定形状のサンプル（例えば端子材料）を採取する方向に依らず、バネ特性等の要求特性を安定して得ることができる銅合金板材等を提供する。【解決手段】本発明の銅合金板材は、Ｎｉを３．５〜２５ｍａｓｓ％およびＳｎを０．１〜９．５ｍａｓｓ％含有し、残部がＣｕおよび不可避不純物からなる合金組成を有し、圧延集合組織を有する電気電子機器用銅合金板材であって、前記圧延集合組織は、ＥＢＳＤによる集合組織解析から得られた、α−ｆｉｂｅｒ（φ1＝０°〜４５°）の方位密度の平均値が、２．５以上３０．０以下の範囲、β−ｆｉｂｅｒ（φ2＝４５°〜９０°）の方位密度の平均値が、２．５以上３０．０以下の範囲であることを特徴とする。【選択図】図１