SUBSTRATE FILM FOR TRANSFERRING AND DECORATING
PROBLEM TO BE SOLVED: To provide a substrate film which has good followability (vacuum moldability) to a molded product of a transferring and decorating film at even a comparatively low temperature condition and is applicable to transferring and decorating, in a technology for producing a decorative...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
14.09.2017
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a substrate film which has good followability (vacuum moldability) to a molded product of a transferring and decorating film at even a comparatively low temperature condition and is applicable to transferring and decorating, in a technology for producing a decorative molding by a vacuum molding method, and to provide a substrate film which is not loosened more than necessary even when the film is heated and softened, can suppress so-called draw-down, and is applicable to transferring and decorating.SOLUTION: A substrate film for transferring and decorating has 5-60 mass% of an ionomer resin with respect to the total mass of a film.SELECTED DRAWING: None
【課題】本発明は、真空成型法により加飾成型品を製造する技術において、比較的低温条件下においても、転写加飾フィルムの成型品に対する追従性(真空成型性)は良好な転写加飾用に適用可能な基体フィルムを提供することを主な目的とする。また、本発明は、フィルムの加熱軟化時においても、必要以上にフィルムがたるまない、所謂ドローダウンを抑制することができる、転写加飾用に適用可能な基体フィルムを提供することを主な目的とする。【解決手段】フィルムの総質量に対し、5〜60質量%のアイオノマー樹脂を有する転写加飾用基体フィルム。【選択図】なし |
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Bibliography: | Application Number: JP20160046215 |