OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

• Main Author: TANIGUCHI YOSHITAKA
• Format: Patent
• Language: English; Japanese
• Published: 07.09.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an optical semiconductor device capable of suppressing a lens from being damaged in mounting or suppressing mounting displacement due to a chip sucking failure.SOLUTION: An optical semiconductor device according to one embodiment includes: a semiconductor substrate having a first surface and a second surface facing the first surface; an electrode formed on the first surface of the semiconductor substrate; an optical element electrically connected to the electrode and formed to the semiconductor substrate; and a lens arranged on a second surface side of the optical element. A recessed portion is formed to the second surface of the semiconductor substrate, and the lens is arranged to the bottom of the recessed portion. The top of the lens on the second surface side is located closer to a first surface side than the second surface located around the recessed portion.SELECTED DRAWING: Figure 1 【課題】実装時のレンズの破損又はチップ吸着不良による実装位置ずれを抑制できる光半導体装置を提供する。【解決手段】一実施形態に係る光半導体装置は、第１面と、第１面に対向する第２面とを有する半導体基板と、半導体基板の第１面上に形成された電極と、電極に電気的に接続され、かつ半導体基板に形成された光素子と、光素子の第２面側に配置されたレンズとを備えている。半導体基板の第２面には凹部が形成されており、レンズは凹部の底部に配置されている。レンズの第２面側の頂部は、凹部の周囲に位置する第２面よりも第１面側に位置している。【選択図】図１