PRESSURE SENSOR

• Main Authors: MORIHARA DAISUKE, OKUGAWA AKIHIRO, OBI MITSUAKI
• Format: Patent
• Language: English; Japanese
• Published: 07.09.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PROBLEM TO BE SOLVED: To provide a pressure sensor chip that can be reduced in size and can be increased in precision.SOLUTION: Provided is a pressure sensor comprising: a pressure sensor chip which comprises a diaphragm, a sensor unit provided in the diaphragm and capable of generating an electric signal depending on the deformation of the diaphragm, and an output terminal for outputting the electric signal from the sensor unit to the outside, and in which a detection unit including a pressure reference chamber the diaphragm and the sensor unit is separated from areas other than the detection unit in a semiconductor substrate by a groove, and the groove communicates with an opening provided in a surface opposite to the surface on which the diaphragm is provided; and a circuit unit for performing a prescribed arithmetic process on the electric signal outputted from the output terminal of the pressure sensor chip. The diaphragm and the output terminal are formed in the same plane, the output terminal of the pressure sensor chip and an input terminal of the circuit unit are fixed so as to directly or indirectly come in contact, and the circuit unit and the pressure sensor chip are covered with a sealing material in such a way that the opening is exposed to the outside.SELECTED DRAWING: Figure 1 【課題】小型化および高精度化が可能な圧力センサチップを提供する。【解決手段】ダイアフラムと、ダイアフラムに設けられ該ダイアフラムの変形に応じた電気信号を発生可能なセンサ部と、センサ部からの電気信号を外部に出力する出力端子部とを備え、圧力基準室、ダイアフラム及びセンサ部を含む検出部と、半導体基板内において検出部以外の領域とが溝によって分離され、溝がダイアフラムが備えられた面の反対面に設けられた開口部と連通した圧力センサチップと、圧力センサチップの出力端子部から出力された電気信号に対して所定の演算処理を行う回路部とを備える圧力センサであって、ダイアフラムと出力端子部が同一面に形成され、圧力センサチップの出力端子と回路部の入力端子部とが直接的または間接的に接するように固定され、回路部及び圧力センサチップは、開口部が外部に露出するように封止材で覆われる。【選択図】図１