DICING ADHESIVE TAPE AND FULL-CUT DICING METHOD OF SEMICONDUCTOR WAFER

• Main Author: AKUTSU AKIRA
• Format: Patent
• Language: English; Japanese
• Published: 31.08.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a dicing adhesive tape and a full-cut dicing method of a semiconductor wafer, which are superior in expandability and which enable the reduction of dicing swarf produced when dicing a semiconductor wafer or the like.SOLUTION: A dicing adhesive tape and a full-cut dicing method of a semiconductor wafer are disclosed. The dicing adhesive tape comprises: a base film; and a sticker layer on at least one face of the base film. The base film includes an ionomer resin of an ethylene-(meth)acrylic acid copolymer, of which the gel fraction is 30-50%. In the dicing adhesive tape, the tear strengths in a lengthwise direction (MD) and a transverse direction (TD) according to a Trouser tear method of JIS K 7128-1 are both 5-12 N/mm.SELECTED DRAWING: None 【課題】半導体ウェハ等のダイシング時に発生するダイシング屑を低減でき、かつエキスパンド性に優れたダイシング用粘着テープ及び半導体ウェハのフルカットダイシング方法を提供する。【解決手段】基材フィルムの少なくとも一方の面に粘着剤層を有し、基材フィルムが、エチレン−（メタ）アクリル酸共重合体のアイオノマー樹脂からなり、かつ基材フィルムのゲル分率が３０〜５０％であり、該ダイシング用粘着テープの縦方向（ＭＤ）および横方向（ＴＤ）のＪＩＳ Ｋ ７１２８−１のトラウザー引裂法による引裂強度が、いずれも５〜１２Ｎ／ｍｍであるダイシング用粘着テープ及び半導体ウェハのフルカットダイシング方法。【選択図】なし