ADHESIVE FILM FOR HALF CUT PROCESSING AND PROCESSING METHOD OF ADHEREND

• Main Authors: HINO KUNIHIRO, GUO JIAMO, SHIMOMURA AYANE
• Format: Patent
• Language: English; Japanese
• Published: 31.08.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; CONVEYING; DYES; HANDLING THIN OR FILAMENTARY MATERIAL; HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PACKING; PAINTS; PERFORMING OPERATIONS; POLISHES; STORING; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide an adhesive film for half cut processing hardly generating slip stick phenomenon during peeling and having no generation of position lag of an adherend when used in processing method of the adherend including half cut processing, and a processing method of the adherend including the half cut processing using the adhesive film for half cut processing.SOLUTION: There is provided an adhesive film for half cut processing for being peeled from an adherend after conducting half cut processing on the adherend at a state with laminated on a surface of the adherend of which the surface has arithmetic average roughness Ra of 1.0 μm to 2.0 μm and ten point average roughness Rz of 5 μm to 15 μm, having a substrate layer and an adhesive layer, the adhesive layer containing a styrenic elastomer and a terpene phenol-based tackifier, and storage elastic modulus G' at 23°C of the adhesive layer is 1.8 MPa to 2.5 MPa.SELECTED DRAWING: None 【課題】剥離時にスリップスティック現象が生じにくく、ハーフカット加工を含む被着体の加工方法に用いたときに、被着体の位置ズレが発生しないハーフカット加工用粘着フィルム、及び、該ハーフカット加工用粘着フィルムを用いたハーフカット加工を含む被着体の加工方法を提供する。【解決手段】一方の表面の算術平均粗さＲａが１．０μｍ以上、２．０μｍ以下、かつ、十点平均粗さＲｚが５μｍ以上、１５μｍ以下である被着体の該表面に貼付した状態で該被着体にハーフカット加工を施した後、該被着体から剥離するためのハーフカット加工用粘着フィルムであって、基材層と粘着剤層とを有し、前記粘着剤層は、スチレン系エラストマーとテルペンフェノール系粘着付与剤とを含有し、前記粘着剤層の２３℃における貯蔵弾性率Ｇ'が１．８ＭＰａ以上、２．５ＭＰａ以下であるハーフカット加工用粘着フィルム。【選択図】なし