ELECTROMAGNETIC INTERFERENCE ENCLOSURE FOR RADIO FREQUENCY MULTI-CHIP INTEGRATED CIRCUIT PACKAGES

• Main Authors: KIM DONG WOOK, YUN CHANGHAN, SONG YOUNG KYU, HWANG KYU-PYUNG
• Format: Patent
• Language: English; Japanese
• Published: 17.08.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide, as one feature, a multi-chip package that includes a substrate and an electromagnetic interference (EMI) shield coupled to the substrate.SOLUTION: At least one integrated circuit is coupled to a first surface of the substrate. The EMI shield includes a metal casing configured to shield the package from radio frequency radiation, a dielectric layer coupled to at least a portion of an inner surface of the metal casing, and a plurality of signal lines. The signal lines are coupled to the dielectric layer and electrically isolated from the metal casing by the dielectric layer. At least one other integrated circuit is coupled to an inner surface of the EMI shield, and at least a portion of the inner surface of the EMI shield faces the first surface of the substrate. The signal lines are configured to provide electrical signals to the second circuit component.SELECTED DRAWING: Figure 10 【課題】一つの特徴は、基板と、基板に接続された電磁妨害（ＥＭＩ）シールドとを含むマルチチップパッケージに関する。【解決手段】少なくとも一つの集積回路が、基板の第１の面に接続される。ＥＭＩシールドは、パッケージを無線周波放射から遮蔽するように構成された金属ケースと、金属ケースの内面の少なくとも一部に接続された誘電体層と、複数の信号線とを含む。信号線は、誘電体層に接続され、誘電体層により金属ケースから電気的に絶縁される。少なくとも一つの他の集積回路が、ＥＭＩシールドの内面に接続され、ＥＭＩシールドの内面の少なくとも一部が、基板の第１の面に対面する。信号線は、電気信号を第２の回路部品に供給するように構成される。【選択図】図１０