SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD, AND COMPUTER READABLE RECORDING MEDIUM WITH SUBSTRATE PROCESSING PROGRAM RECORDED THEREIN

PROBLEM TO BE SOLVED: To satisfactorily process a substrate by suppressing the occurrence of watermark or remaining of particles.SOLUTION: A substrate processing apparatus includes: a substrate rotation part (11) for rotating a substrate (3) while holding it; a processing liquid supply part (13) for...

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Bibliographic Details
Main Authors YOSHIDA YUKI, SHINOHARA KAZUYOSHI
Format Patent
LanguageEnglish
Japanese
Published 17.08.2017
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Summary:PROBLEM TO BE SOLVED: To satisfactorily process a substrate by suppressing the occurrence of watermark or remaining of particles.SOLUTION: A substrate processing apparatus includes: a substrate rotation part (11) for rotating a substrate (3) while holding it; a processing liquid supply part (13) for supplying processing liquid to the substrate (3); and a replacement liquid supply part (14) for supplying to the substrate (3), replacement liquid which is replaced with the processing liquid supplied from the processing liquid supply part (13). The substrate (3) is rotated by the substrate rotation part (11), the processing liquid is supplied to the substrate (3) by the processing liquid supply part (13), and the replacement liquid is then supplied to the substrate (3) by the replacement liquid supply part (14). The processing liquid is complemented from the processing liquid supply part (13) to an outer peripheral side of the substrate (3) than the replacement liquid supplied from the replacement liquid supply part (14), and thus a liquid film of the processing liquid is formed.SELECTED DRAWING: Figure 2 【課題】ウォーターマークの発生やパーティクルの残存を抑制し、基板の処理を良好に行えるようにすること。【解決手段】本発明では、基板(3)を保持しながら回転させる基板回転部(11)と、前記基板(3)に処理液を供給する処理液供給部(13)と、前記処理液供給部(13)から供給された前記処理液と置換させる置換液を前記基板(3)に供給する置換液供給部(14)とを備え、前記基板回転部(11)によって前記基板(3)を回転させ、前記処理液供給部(13)によって前記基板(3)に前記処理液を供給させ、その後、前記置換液供給部(14)によって前記基板(3)に前記置換液を供給させるとともに、前記置換液供給部(14)から供給される置換液よりも前記基板(3)の外周側に前記処理液供給部(13)から前記処理液を補給して処理液の液膜を形成することにした。【選択図】図2
Bibliography:Application Number: JP20170061138