THERMOSETTING SHEET FOR HOLLOW SEALING OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE HOLLOW-SEALED USING THE SAME

• Main Authors: IWANAGA YUKIHIRO, NAKAMURA YUKI
• Format: Patent
• Language: English; Japanese
• Published: 10.08.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a thermosetting sheet for hollow sealing of a semiconductor device, excellent in sealing properties, flux resistance, flux cleaning solution resistance, resistance against sealing material ingress pressure, and reliability, and a semiconductor device hollow-sealed us...