THERMOSETTING SHEET FOR HOLLOW SEALING OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE HOLLOW-SEALED USING THE SAME
PROBLEM TO BE SOLVED: To provide a thermosetting sheet for hollow sealing of a semiconductor device, excellent in sealing properties, flux resistance, flux cleaning solution resistance, resistance against sealing material ingress pressure, and reliability, and a semiconductor device hollow-sealed us...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
10.08.2017
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Subjects | |
Online Access | Get full text |
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