SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

• Main Author: TADAKI SHINJI
• Format: Patent
• Language: English; Japanese
• Published: 10.08.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To improve reliability.SOLUTION: A semiconductor device comprises: a semiconductor element 20 that comprises a first pillar 22; a semiconductor element 30 whose second pillar 32 is bonded with the first pillar 22, and flip-chip mounted on the semiconductor element 20; a barrier layer 44 provided on at least one of the first pillar 22 and the second pillar 32; and a bonding material 46 that bonds the first pillar 22 and the second pillar 32 with each other. The bonding material 46 is contacted with at least one of the first pillar 22 and the second pillar 32, and with the barrier layer 44, and is formed of a metal compound of a metal element that configures a pillar contacted with the bonding material 46 among the first pillar 22 and the second pillar 32, and a metal element that configures solder.SELECTED DRAWING: Figure 2 【課題】信頼性を向上させること。【解決手段】第１ピラー２２を備える半導体素子２０と、第１ピラー２２に第２ピラー３２が接合されて、半導体素子２０にフリップチップ実装された半導体素子３０と、第１ピラー２２及び第２ピラー３２の少なくとも一方に設けられたバリア層４４と、第１ピラー２２と第２ピラー３２とを接合する接合部材４６と、を備え、接合部材４６は、第１ピラー２２及び第２ピラー３２の少なくとも一方とバリア層４４とに接していて第１ピラー２２及び第２ピラー３２のうちの接合部材４６が接するピラーを構成する金属元素と半田を構成する金属元素との金属間化合物からなる、半導体装置。【選択図】図２