LED MODULE

• Main Author: KOBAYAKAWA MASAHIKO
• Format: Patent
• Language: English; Japanese
• Published: 03.08.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an LED module which achieves downsizing.SOLUTION: An LED module includes: a first electrode (a first lead 1A) having a first surface (a surface 11A) facing in a thickness direction (a z direction); an LED chip 2 mounted on the first surface of the first electrode; and a case 4 covering part of the first electrode and having a side wall part 41 enclosing the LED chip 2. The case 4 has a first holding part 43A which covers part of the first surface of the first electrode and sandwiches a corner of the first electrode from both sides in the thickness direction. A first protruding part protruding from the side wall part 41 in a thickness direction view of the first electrode is formed in the first holding part 43A.SELECTED DRAWING: Figure 1 【課題】 小型化を図ることが可能なＬＥＤモジュールを提供する。【解決手段】 厚さ方向（ｚ方向）を向く第１表面（表面１１Ａ）を有する第１電極（第１リード１Ａ）と、第１電極の第１表面に搭載されたＬＥＤチップ２と、第１電極の一部を覆い、かつＬＥＤチップ２を囲む側壁部４１を有するケース４と、を備え、ケース４は、第１電極の第１表面の一部を覆い、かつ厚さ方向の両側から第１電極の角を挟み込む第１保持部４３Ａを有しており、第１保持部４３Ａには、第１電極の厚さ方向視において側壁部４１から突出する第１凸部が形成されている。【選択図】 図１