COMPONENT MOUNTING DEVICE

PROBLEM TO BE SOLVED: To provide a component mounting device capable of suppressing the efficiency of a component mounting operation in splicing a tape.SOLUTION: The component mounting device includes: a head unit 4 for mounting a component E on a substrate P; a component supply part 3 on which a ta...

Full description

Saved in:
Bibliographic Details
Main Author FUKUDA TAKAFUMI
Format Patent
LanguageEnglish
Japanese
Published 03.08.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a component mounting device capable of suppressing the efficiency of a component mounting operation in splicing a tape.SOLUTION: The component mounting device includes: a head unit 4 for mounting a component E on a substrate P; a component supply part 3 on which a tape feeder 31 for supplying a tape 331 retaining a predetermined component E is placed; and a control part 9 for controlling to restrain feeding of the tape 331 for performing splicing, on the basis of the fact that a user's operation for splicing is detected, in splicing the tape 331 of the tape feeder 31.SELECTED DRAWING: Figure 1 【課題】テープのスプライシングを行う場合に、部品実装動作の効率が悪くなるのを抑制することが可能な部品実装装置を提供する。【解決手段】この部品実装装置は、部品Ｅを基板Ｐに実装するヘッドユニット４と、所定の部品Ｅを保持したテープ３３１を供給するテープフィーダ３１が配置される部品供給部３と、テープフィーダ３１のテープ３３１をスプライシングする場合に、スプライシングのためのユーザの操作を検知したことに基づいて、スプライシングを行うテープ３３１の送りを抑制する制御を行う制御部９とを備える。【選択図】図１
Bibliography:Application Number: JP20160016421