IMAGE PICK-UP DEVICE MOUNTING BOARD AND IMAGING DEVICE

• Main Authors: ICHIKI SHINJI, FUNAHASHI AKIHIKO
• Format: Patent
• Language: English; Japanese
• Published: 03.08.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an image pick-up device mounting board capable of suppressing occurrence of an inclination between a wiring board and an inorganic board, and to provide an imaging device.SOLUTION: An image pick-up device mounting board includes an image pick-up device mounting part 11 where an image pick-up device 10 is mounted in the central region 4b of the uppermost surface, an inorganic board 4 having a peripheral region 4a surrounding the image pick-up device mounting part 11, a frame-like wiring board 2 provided on the peripheral region 4a of the inorganic board 4, and surrounding the image pick-up device mounting part 11, a first joint material 15a provided between the inorganic board 4 and wiring board 2, continuously along the inner edge of the peripheral region 4a, and multiple second joint materials 15b scattered in the peripheral region 4a while spaced apart from the first joint material 15a, between the inorganic board 4 and wiring board 2.SELECTED DRAWING: Figure 1 【課題】 配線基板と無機基板との間に傾きが発生することを抑制することが可能となる撮像素子実装用基板および撮像装置を提供することである。【解決手段】 撮上面の中央領域４ｂに撮像素子１０が実装される撮像素子実装部１１と、撮像素子実装部１１を取り囲む周辺領域４ａを有する無機基板４と、無機基板４の周辺領域４ａ上に設けられ、撮像素子実装部１１を取り囲む枠状の配線基板２と、無機基板４と配線基板２の間であって、周辺領域４ａの内縁に沿って連続して設けられた第１接合材１５ａと、無機基板４と配線基板２の間であって、周辺領域４ａに第１接合材１５ａと間を空けて点在した複数の第２接合材１５ｂとを備えている。【選択図】図１