ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide an electronic apparatus that contributes to downsize a casing and capable of discharging air inside the casing warmed and raised by heat generated from electronic parts to an outside of the casing without providing a ventilation space in an upper part of the casing w...

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Bibliographic Details
Main Author NAGAOKA HIROSHI
Format Patent
LanguageEnglish
Japanese
Published 27.07.2017
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Summary:PROBLEM TO BE SOLVED: To provide an electronic apparatus that contributes to downsize a casing and capable of discharging air inside the casing warmed and raised by heat generated from electronic parts to an outside of the casing without providing a ventilation space in an upper part of the casing while satisfying structural constraints of electronic apparatus that it is not possible to provide ventilation openings on upper and lower faces and front and rear faces of the casing and forced air cooling by a fan is not possible.SOLUTION: An upper notch portion is provided on an upper side of a substrate installed parallel to a side face of a casing having an air inlet and an air outlet, and a flow path for discharging air inside the casing to an outside of the casing is secured.SELECTED DRAWING: Figure 1 【課題】筐体の上下面および前後面に通風口を設けられず、ファンによる強制空冷できないという電子機器の構造上の制約を満足した上で、筐体の上部に通風用空間を設けることなく、電子部品から発生する熱によって暖められ上昇した筐体内部の空気を筐体外部へ排出することができ、筐体の小型化に寄与した電子機器を得る。【解決手段】吸気口および排気口を有する筐体の側面に対して平行に設置された基板の上辺に上部切欠き部を設け、筐体の内部の空気を筐体の外部へ排出させるための流路を確保した。【選択図】 図1
Bibliography:Application Number: JP20160008104