METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE

• Main Authors: TANG QIN, CHIT YIU CHAN, TONG KIT HO, KWOK WAI DENNIS YEE
• Format: Patent
• Language: English; Japanese
• Published: 27.07.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To effectively prevent a copper surface of a printed circuit board from being oxidized either during storage or by soldering.SOLUTION: A method of forming organic coatings on a copper surface by two steps of immersion in two solutions comprises a first step of contacting the copper surface with a first solution including an azole compound and a second step of contacting the copper surface treated by the first solution with a second solution including a 1H-imidazo[4,5-b]pyrazine derivative represented by formula (I).SELECTED DRAWING: None 【課題】プリント基板の銅表面が、保管時あるいは半田付けにより酸化することを効果的に防止する。【解決手段】２つの溶液に浸漬する２つのステップで有機被膜を形成する方法であって、第１のステップで、アゾール化合物を含む第１の溶液とを接触させ、第２のステップで第１の溶液によって処理された銅表面を、式（Ｉ）で表される１Ｈ−イミダゾ［４，５−ｂ］ピラジン誘導体を含む第２の溶液とを接触させる、銅表面上に有機被膜を形成するための方法。【選択図】なし